6/1/2023 0 Comments Integrity solutionsDepending on the relative rate of switching (rise and fall times of the signals) and the amount of mutual capacitance, there can be significant crosstalk noise. With the scaling of the horizontal dimensions of wires, the aspect ratio of the horizontal to vertical dimensions is reduced, resulting in increased ratios of coupling capacitan ce (lateral) to ground capacitance (over or under crossovers or to substrate). A single data model, combined with an integrated design system, is necessary to address deep-submicron effects efficiently and to provide design closure in a timely manner. The ability of a physical design system concurrently to analyze and correct for various signal integrity problems during a physical implementation flow is highly dependent on the architecture of the design system. For a successful tapeout and reliability, signal integrity issues must be resolved during the design flow. Variations on a single die complicate the design process. "Signal integrity" refers to a broad set of integrated-circuit design issues, such as crosstalk noise, electromigration and IR drop, and such manufacturing-related issues as antenna effects. Special tool capabilities are needed to ensure that all aspects of the design, from timing cl osure to signal integrity to power requirements, are addressed simultaneously. The ever-increasing complexity of system-on-chip design, coupled with uncorrelated tool flows, makes it more difficult to achieve design closure on all fronts. Design flows using various point tools fail to predict final timing during early stages of the design. Previously dismissed as secondary effects, cross coupling, via resistance, inductance, power integrity and wire self-heating become first-order design parameters. Timing is dominated by interconnect-dependent RC delay in deep-submicron designs. Incorporating signal integrity solutions into the IC design flow thus becomes a necessity. The number of silicon failures caused by signal integrity problems is on the rise because existing design tools and methodologies cannot address these issues effectively. EST) URL: ĭesigning ICs on 0.13-micron and smaller process technologies poses tremendous challenges. Signal integrity a challenge in IC design By Emre Tuncer, EE Times J(11:00 a.m. ![]() Signal integrity a challenge in IC design
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